Job Description

You will be a member of the Oregon Disaggregation Manufacturing (ODM) organization, responsible for deploying and ramping up advanced packaging technologies and products. The Yield Integration Engineers are responsible for partnering with process engineering, manufacturing, Q and R, and support teams to drive process sustaining excellence, responding to and driving resolution of process quality events, change control, and new product introduction.

As the Yield/Integration Engineer, you will be responsible for but not limited to:

• New Product Introduction (NPI) activities, which include leading coordination efforts within the factory to meet program milestones.
• Responding to quality events in the high-volume WLA process line, containing, and dispositioning suspect material, and driving preventative measures.
• Partnering with process engineering and manufacturing teams to harden High Volume Manufacturing (HVM) processes.
• Leading cross-functional teams through model-based problem-solving methodology to resolve process excursions and championing usage of defect metrology systems for defect reduction activities for line yield or electrical yield improvements.
• Partnering with Technology and Development (TD) and factory partners to certify and ramp new technologies and products and own transfer to subsequent HVM factories.

The ideal candidate should exhibit the following behavioral traits:

• Communication skills and willingness to work with teams spread across different geographies and organizations.
• Must role model One Intel culture and possess fast learning skills to understand new concepts related to diverse fields and apply them on the job to solve complex problems.

Qualifications

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:

The candidate must possess at least one of the following degrees plus the years of experience determined for each degree in the areas specified below:

• A Master's degree or Ph.D. degree in Material Science, Chemistry, Physics, Electrical, Chemical, Mechanical Engineering, or related technical field with 2+ years of wafer fab, die preparation, or assembly experience.

OR

• A Bachelor's degree in Material Science, Chemistry, Physics, Electrical, Chemical, Mechanical Engineering, or related technical field with 4+ years of wafer fab, die preparation, or assembly experience.

Preferred Qualifications:

• Experience with either of the following:
• Startup of new technologies.
• Deployment of new business processes.
• Leadership.
• Leadership in Model-Based Problem Solving (MBPS) Teams.
• Process improvement using Intel Change Control Process.
• NPI project management.
• Process Continuous Improvement projects.
• Yield analyses scripting.
• Defect Metrology Systems for defect reduction.
• Low Yield Analyses/Failure Analyses Techniques.

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art - from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.

Covid Statement

Intel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here: https://www.intel.com/content/www/us/en/jobs/benefits.html

Working Model

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. In certain circumstances the work model may change to accommodate business needs.

JobType

Hybrid